| Product | Description | Components | Mixing Ratio (pbw) | Tg, DSC (°C) | Viscosity (mPa.s) | Pot-life | Application | Viscosity (Pa.s, 25°C) | Epoxy Index (mol/kg) | EEW (g/mol) | Hydrolyzable chlorine (%) | Colour (Gardner) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SADURIT® H 560-1687 | HCEP system. Excellent crack resistance at low temperatures, good toughness. UL 94 HB. | A/B | 100/100 | 90-105 | 5 000/60°C | 2 h/60°C | — | — | — | — | — | — |
| CHS-EPOXY® B 200 M 80 | 80% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketone | — | — | — | — | — | Prepregs for printed circuits boards, laminates | 1,1-2,3 | 1,8-2,3 | 435-556 | max. 0,1 | max.1 |
Product Notes
1) Viscosity of 70% solution in butylglycol/25°C, 2) Viscosity of 40% solution in butylglycol/25°C, 3) In a solution, 4) Recommended mixing ratio with filler, 5) Viscosity at 25°C (Brookfield), 6) System (part A:B) has to be mixed with water in the recommended correct ratio – see Application Sheet, 7) System (part A:B) can be filled with additional filler in the recommended correct ratio – see Application Sheet, 9) Viscosity (Pa.s, 20°C), 11) In time of loading, 12) Depends on technology used
You can also find a comprehensive range of products in the product catalogue (PDF).
If you require detailed product information, please do not hesitate to contact us.
