Low Voltage Casting, Encapsulating and Potting

Low Voltage Casting, Encapsulating and Potting

ProductDescriptionComponentsMixing Ratio (pbw)Tg, DSC (°C)Viscosity (mPa.s)Pot-life
CHS-EPODUR® 531-0522Room temperature cured modified resin system, long potlife. Two component with prefilled component A.A/B100/13100-1106 000/25°C2 h/25°C/1 000 g

Product Notes

1) Viscosity of 70% solution in butylglycol/25°C, 2) Viscosity of 40% solution in butylglycol/25°C, 3) In a solution, 4) Recommended mixing ratio with filler, 5) Viscosity at 25°C (Brookfield), 6) System (part A:B) has to be mixed with water in the recommended correct ratio – see Application Sheet, 7) System (part A:B) can be filled with additional filler in the recommended correct ratio – see Application Sheet, 9) Viscosity (Pa.s, 20°C), 11) In time of loading, 12) Depends on technology used

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