Modified Epoxy Resins

Epoxy Resins - Solution

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWHydrolysable chlorine Colour (Gardner)
CHS-EPOXY® 200 M 75Solution in methyl ethyl ketoneProduction of prepregs0-2,01,9-2,3435-525max. 0,015max.1
CHS-EPOXY® 200 M 80Solution in methyl ethyl ketoneProduction of prepregs2,5-5,52,0-2,4410-500max. 0,015max.1
CHS-EPOXY® 520 M 8080% solution in methyl ethyl ketoneHigh solid coatings, prepregs etc.0,04-0,054,1-4,4 //3227-244 //3

Epoxy Resins based on BPA/BPF

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWHydrolysable chlorine Colour (APHA)
CHS-EPOXY® 573BPA/F epoxy resinCoatings, penetrants, filled systems, casting applications and insulating materials8,0-10,55,3-5,6179-189max. 0,03max.100
CHS-EPOXY® 574BPA/F resin modified by difunctional reactive diluentComposites, civil and electrical engineering, high-solid coatings1,4-1,75,5-5,75174-182max. 0,1max.100
CHS-EPOXY® 575BPA/F resin modified by difunctional reactive diluentSolventless coatings, penetrants, filled systems, casting applications and insulating materials, high solid coatings0,7-0,95,6-5,9169-179max. 0,1max.100
CHS-EPOXY® 572BPA/F epoxy resinCoatings, penetrants, filled systems, casting applications and insulating materials4,5-7,05,5-5,8172-182max. 0,03max.100
CHS-EPOXY® 514BPA/F resin modified by monofunctional reactive diluentComposites, high solid, anticorrosion paints, civil engineering, casting0,8-1,15,1-5,4185-196max. 0,1max.100
CHS-EPOXY® 571BPA/F epoxy resinCoatings, penetrants, filled systems, casting applications and insulating materials6,0-8,05,4-5,7175-185max. 0,03max.100

Modified Liquid Resins

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWColour (APHA)
CHS-EPOXY® 498Epoxy resin modified with mono-functional reactive diluentCivil engineering, potting and impregnation0,5- 0,74,8-5,1196-208max.100

Brominated Epoxy Resins

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWHydrolysable chlorine Colour (Gardner)
CHS-EPOXY® B 201 M 8080% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketonePrepregs for printed circuits boards, laminates, UV blocking1,5-22,3-2,5400-435max. 0,1max.1
CHS-EPOXY® B 200 M 8080% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketonePrepregs for printed circuits boards, laminates1,1-2,31,8-2,3435-556max. 0,1max.1

You can also find a comprehensive range of products in the product catalogue (PDF).

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