Transport

Hardeners & Reactive Diluents

ProduktDescriptionApplicationViscosity (mPa)Epoxy indexHydrolysable chlorine Colour (Gardner)
CHS-EPOXY® RR 8001, 4-butanediol diglycidyl etherExcellent reactivity at low temperatures and good solvent resistance, high mechanical strength, limited acid resistanceOct-257,60-8,10max. 0,2max.1*
CHS-EPOXY® RR 690Trimethylol propane triglycidyl etherExcellent mechanical strength and reactivity, hot water and solvent resistance, limited diluting power130-2007,20-7,70max. 0,1max.1*
CHS-EPOXY® RR 330C12-C14 alkyl glycidyl etherLow toxicity and vapour pressure, good diluting power, reduced reactivity5-Oct2,94-3,70max. 0,1max.1*
CHS-EPOXY® RR 7001, 6-hexanediol diglycidyl etherExcellent reactivity at low temperatures and good solvent resistance, high mechanical strength, limited acid resistance15-256,70-7,20max. 0,2max.1*
CHS-EPOXY® RR 300Polypropyleneglycol diglycidyl etherFlexibilizer, low toxicity and vapour pressure, reduced reactivity, limited diluting power40-902,90-3,30max. 0,3max.2*

Reactive Diluents

ProduktDescriptionApplicationViscosity (mPa)Epoxy indexHydrolysable chlorine Colour (Gardner)
CHS-EPOXY® RR 8001, 4-butanediol diglycidyl etherExcellent reactivity at low temperatures and good solvent resistance, high mechanical strength, limited acid resistanceOct-257,60-8,10max. 0,2max.1*
CHS-EPOXY® RR 690Trimethylol propane triglycidyl etherExcellent mechanical strength and reactivity, hot water and solvent resistance, limited diluting power130-2007,20-7,70max. 0,1max.1*
CHS-EPOXY® RR 330C12-C14 alkyl glycidyl etherLow toxicity and vapour pressure, good diluting power, reduced reactivity5-Oct2,94-3,70max. 0,1max.1*
CHS-EPOXY® RR 7001, 6-hexanediol diglycidyl etherExcellent reactivity at low temperatures and good solvent resistance, high mechanical strength, limited acid resistance15-256,70-7,20max. 0,2max.1*
CHS-EPOXY® RR 300Polypropyleneglycol diglycidyl etherFlexibilizer, low toxicity and vapour pressure, reduced reactivity, limited diluting power40-902,90-3,30max. 0,3max.2*

Hardeners

ProduktDescriptionApplicationViscosity (mPa)Amino numberHEW
TELALIT® 0600Cycloaliphatic, modifiedHigh performance composites, long pot life, highest Tg80-100450-50062
TELALIT® 0842Solvent free system, under water curingHardening in wet conditions, applicable in different weather conditions.1 100-1 900min.29084
TELALIT® 0590PolyoxyetheramineComposites, long pot life5-Oct440-49059
TELALIT® 0903Cycloaliphatic adduct modifiedSelf-levelling flooring, nonylphenol free, low yellowing200-500320-35090
TELALIT® 1040PolyoxyetheramineWaterborne coatings, high solid coatings, nonylphenol free.Oct-30230-260104

Modified Epoxy Resins

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWHydrolysable chlorine Colour (APHA)
CHS-EPOXY® 573BPA/F epoxy resinCoatings, penetrants, filled systems, casting applications and insulating materials8,0-10,55,3-5,6179-189max. 0,03max.100
CHS-EPOXY® 574BPA/F resin modified by difunctional reactive diluentComposites, civil and electrical engineering, high-solid coatings1,4-1,75,5-5,75174-182max. 0,1max.100
CHS-EPOXY® 575BPA/F resin modified by difunctional reactive diluentSolventless coatings, penetrants, filled systems, casting applications and insulating materials, high solid coatings0,7-0,95,6-5,9169-179max. 0,1max.100
CHS-EPOXY® B 201 M 8080% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketonePrepregs for printed circuits boards, laminates, UV blocking1,5-22,3-2,5400-435max. 0,1
CHS-EPOXY® 572BPA/F epoxy resinCoatings, penetrants, filled systems, casting applications and insulating materials4,5-7,05,5-5,8172-182max. 0,03max.100

Epoxy Resins - Solution

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWHydrolysable chlorine Colour (Gardner)
CHS-EPOXY® 200 M 75Solution in methyl ethyl ketoneProduction of prepregs0-2,01,9-2,3435-525max. 0,015max.1
CHS-EPOXY® 200 M 80Solution in methyl ethyl ketoneProduction of prepregs2,5-5,52,0-2,4410-500max. 0,015max.1
CHS-EPOXY® 520 M 8080% solution in methyl ethyl ketoneHigh solid coatings, prepregs etc.0,04-0,054,1-4,4 //3227-244 //3

Epoxy Resins based on BPA/BPF

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWHydrolysable chlorine Colour (APHA)
CHS-EPOXY® 573BPA/F epoxy resinCoatings, penetrants, filled systems, casting applications and insulating materials8,0-10,55,3-5,6179-189max. 0,03max.100
CHS-EPOXY® 574BPA/F resin modified by difunctional reactive diluentComposites, civil and electrical engineering, high-solid coatings1,4-1,75,5-5,75174-182max. 0,1max.100
CHS-EPOXY® 575BPA/F resin modified by difunctional reactive diluentSolventless coatings, penetrants, filled systems, casting applications and insulating materials, high solid coatings0,7-0,95,6-5,9169-179max. 0,1max.100
CHS-EPOXY® 572BPA/F epoxy resinCoatings, penetrants, filled systems, casting applications and insulating materials4,5-7,05,5-5,8172-182max. 0,03max.100
CHS-EPOXY® 514BPA/F resin modified by monofunctional reactive diluentComposites, high solid, anticorrosion paints, civil engineering, casting0,8-1,15,1-5,4185-196max. 0,1max.100

Modified Liquid Resins

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWColour (APHA)
CHS-EPOXY® 498Epoxy resin modified with mono-functional reactive diluentCivil engineering, potting and impregnation0,5- 0,74,8-5,1196-208max.100

Brominated Epoxy Resins

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWHydrolysable chlorine Colour (Gardner)
CHS-EPOXY® B 201 M 8080% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketonePrepregs for printed circuits boards, laminates, UV blocking1,5-22,3-2,5400-435max. 0,1max.1
CHS-EPOXY® B 200 M 8080% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketonePrepregs for printed circuits boards, laminates1,1-2,31,8-2,3435-556max. 0,1max.1

Chlorine Products

ProduktDescriptionColour (APHA)Concentration1,5 HexadieneStabilizer
Allyl chlorideClear liquid with characteristic pungent odour, extremely flammable, sensitive to UV radiation (darkens).< 50> 99< 0,30,015-0,025 //11

Allylchloride

ProduktDescriptionColour (APHA)Concentration1,5 HexadieneStabilizer
Allyl chlorideClear liquid with characteristic pungent odour, extremely flammable, sensitive to UV radiation (darkens).< 50> 99< 0,30,015-0,025 //11

Epoxy Systems for Composites

ProduktDescriptionComponentsMixing ratioTg, DSCPot-life
CHS-EPODUR® 561-1557Hydrophobic cycloaliphatic epoxy resin and hardener system suitable for outdoor application in severe climatic conditions. Good UV resistance. High Tg. The product complies with the fire safety requirements set out in EN 45545-2.A/B/C2/D5100/90/0,5/10/390100 - 1201-2 h/60°C
VEROBOND® 531-0903Epoxy adhesive with low viscosity, cured at room temperature. Optimal for chemical anchors.A/B100/5050-6035 min/25°C/400g
VEROBOND® 520-2608Structural adhesive with high elongation up to 55% with excellent peel and shear strength.A/B100/14070-8020 min/25°C/50g
VEROBOND® SUPERStructural adhesive with high elongation up to 55% with excellent peel and shear strength.A/B100/10070-8020 min/25°C/10g
VEROBOND® QUICKUnique, very fast epoxy adhesive (5 minutes curing time).A/B100/10050-603 min/25°C/10g

Hand Lay-up, infusion and injection systems, RTM

ProduktDescriptionComponentsMixing ratioTg, DSCPot-lifeViscosity (mPa.s)
CHS-EPODUR® 520-1997High thermal resistance. Post curing above 160°C.A/B/C3100/95/1165-175> 10 h/25°C1 000-1 200 //5
CHS-EPODUR® 520-1687Long pot life, low viscosity. Curing at higher temperature (at least 80°C).A/B/C2100/90/1130-145> 10 h/25°C500-1 000 //5
CHS-EPODUR® 574-0904Laminated system with medium viscosity. High adhesion to dural, steel and other metal surfaces.A/B100/5070-8012-15 min/25°C1 600-2 200 //5
CHS-EPODUR® 520-1667Low viscosity. Curing at higher temperature (at least 80°C).A/B/C2100/85/1115-130> 10 h/25°C500-1 000 //5
CHS-EPODUR® 520-1787High mechanical properties, long pot life. Curing at higher temperature (at least 80°C).A/B/C1/D1100/85/0.5/1085-95> 10 h/25°C1 500-2 000 //5

Prepreg Matrix Systems

ProduktDescriptionComponentsMixing ratioTg, DSCPot-life
CHS-EPODUR® 525-0269Solvent-free epoxy prepregging system with chemically induced B-stage, adjustable tack/ drapability. For cold, simple equipped processing. Recommended for general industrial and sport & leisure applications.A/B/C55100/12/0-3115 - 1352 - 8 h //12
CHS-EPODUR® 411-0269Solvent-free epoxy system for hot-melt prepregging, adjustable tack. For industrial and sport & leisure composite applications.A/B/C55100/9/0-2120 - 1280,5 - 2 h //12
CHS-EPODUR® N 554-0249Solvent-free epoxy system for hot-melt prepregging, adjustable tack/drapability. For applications with higher temperature resistance.A/B/C55100/10/0-3120 - 1651 - 4 h //12

Filament Winding & Pultrusion Systems

ProduktDescriptionComponentsMixing ratioTg, DSCPot-lifeViscosity (mPa.s)
CHS-EPODUR® 520-1687Long pot life, medium viscosity. Curing at higher temperature (at least 80°C).A/B/C2100/90 /1130-145> 10 h/25°C500-1 000 //5
CHS-EPODUR® 520-1667Medium viscosity. Curing at higher temperature (at least 80°C).A/B/C2100/85/1115-130> 10 h/25°C500-1 000 //5
CHS-EPODUR® 520-1997High thermal resistance. Post curing above 160°C.A/B/C3100/95/1165-175> 10 h/25°C1 000-1 200 //5
CHS-EPODUR® 520-1787High mechanical properties, long pot life. Curing at higher temperature (at least 80°C).A/B/C1/D1100/85/0,5/1085-95> 10 h/25°C1 500-2 000 //5
CHS-EPODUR® 574-0522Curing at ambient temperature, slow reactivity.A/B100/3085-1001-2 h/25°C200-500 //5

Adhesives for Composites

ProduktDescriptionComponentsMixing ratioTg, DSCPot-lifeShear strength
VEROBOND® 520-2608Structural adhesive with high elongation up to 55% with excellent peel and shear strength.A/B100/14070-8020 min/25°C/50g20-25
VEROBOND® SUPERStructural adhesive with high elongation up to 55% with excellent peel and shear strength.A/B100/10070-8020 min/25°C/10g20-24
VEROBOND® QUICKUnique, very fast epoxy adhesive (5 minutes curing time).A/B100/10050-603 min/25°C/10g10-Dec
VEROBOND® 14Epoxy adhesive cured at room temperature. Systems is a thixotropic paste of high strength with good chemical resistance.A/B100/5080-8560 min/25°C/100g20-24
VEROBOND® 521-0846Two-component epoxy structural adhesive. It is used for structural bonding of a wide range of substrates, especially metals, metal structures, wood and ceramics.A/B100/5060-7028 min/25°C/15g6-Aug

Basic Epoxy Resins

ProduktDescriptionApplicationEpoxy indexEEW
CHS-EPOXY® 301BPA type semisolid epoxy resinHot casting, solventborne coatings, prepregs2,7-3,3300-370
CHS-EPOXY® 530BPA typeModifications, adhesives, composites5,38-5,68176-186
CHS-EPOXY® 411BPA type semisolid epoxy resinHot casting, solventborne coatings, prepregs3,9-4,2238-256
CHS-EPOXY® 590BPF typeModifications, adhesives, composites5,70-6,06165-175
CHS-EPOXY® 520BPA typeModifications, adhesives, composites5,21-5,50182-192

Semi-solid Epoxy Resins

ProduktDescriptionApplicationEpoxy indexEEW
CHS-EPOXY® 301BPA type semisolid epoxy resinHot casting, solventborne coatings, prepregs2,7-3,3300-370
CHS-EPOXY® 411BPA type semisolid epoxy resinHot casting, solventborne coatings, prepregs3,9-4,2238-256

Unmodified Liquid Resins

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWHydrolysable chlorine Colour (APHA)
CHS-EPOXY® 530BPA typeModifications, adhesives, composites8,0-10,05,38-5,68176-186max. 0,03max.100
CHS-EPOXY® 590BPF typeModifications, adhesives, composites3,0-5,55,70-6,06165-175max. 0,03max.100
CHS-EPOXY® 510BPA type, low tendency to crystallizeModifications, adhesives, composites12,5-16,05,18-5,46183-193max. 0,03max.200
CHS-EPOXY® 525 LABPA type with low α-glycol contentModifications, adhesives, composites10,0-12,05,30-5,50182-189max. 0,03max.100
CHS-EPOXY® 520BPA typeModifications, adhesives, composites12,0-14,55,21-5,50182-192max. 0,03max.100

Unmodified Liquid Resins - EnviPOXY®

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWHydrolysable chlorine Colour (APHA)
ENVIPOXY® 525BPA typeModifications, adhesives, composites10,0-12,05,29-5,59179-189max. 0,03max.100
ENVIPOXY® 510BPA type, low tendency to crystallizeModifications, adhesives, composites12,5-16,05,18-5,46183-193max. 0,03max.200
ENVIPOXY® 530BPA typeModifications, adhesives, composites8,0-10,05,38-5,68176-186max. 0,03max.100
ENVIPOXY® 520BPA typeModifications, adhesives, composites12,0-14,55,21-5,50182-192max. 0,03max.100

Epoxy Systems for Electronics

ProduktDescriptionComponentsMixing ratioTg, DSCPot-life
CHS-EPODUR® 561-1557Hydrophobic cycloaliphatic epoxy resin and hardener system suitable for outdoor application in severe climatic conditions. Good UV resistance. High Tg. The product complies with the fire safety requirements set out in EN 45545-2.A/B/C2/D5100/90/0,5/10/390100 - 1201-2 h/60°C
CHS-EPOXY® B 201 M 8080% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketone
CHS-EPOXY® B 200 M 8080% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketone

Brominated Epoxy Resins

ProduktDescriptionApplicationViscosity (Pa)Epoxy indexEEWHydrolysable chlorine Colour (Gardner)
CHS-EPOXY® B 201 M 8080% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketonePrepregs for printed circuits boards, laminates, UV blocking1,5-22,3-2,5400-435max. 0,1max.1
CHS-EPOXY® B 200 M 8080% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketonePrepregs for printed circuits boards, laminates1,1-2,31,8-2,3435-556max. 0,1max.1

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