| Produkt | Description | Colour (APHA) | Concentration | 1,5 Hexadiene | Stabilizer |
|---|---|---|---|---|---|
| Allyl chloride | Clear liquid with characteristic pungent odour, extremely flammable, sensitive to UV radiation (darkens). | < 50 | > 99 | < 0,3 | 0,015-0,025 //11 |
| Produkt | Description | Colour (APHA) | Concentration | 1,5 Hexadiene | Stabilizer |
|---|---|---|---|---|---|
| Allyl chloride | Clear liquid with characteristic pungent odour, extremely flammable, sensitive to UV radiation (darkens). | < 50 | > 99 | < 0,3 | 0,015-0,025 //11 |
| Produkt | Description | Application | Viscosity (Pa) | Epoxy index | EEW | Hydrolysable chlorine | Colour (APHA) |
|---|---|---|---|---|---|---|---|
| CHS-EPOXY® 573 | BPA/F epoxy resin | Coatings, penetrants, filled systems, casting applications and insulating materials | 8,0-10,5 | 5,3-5,6 | 179-189 | max. 0,03 | max.100 |
| CHS-EPOXY® 574 | BPA/F resin modified by difunctional reactive diluent | Composites, civil and electrical engineering, high-solid coatings | 1,4-1,7 | 5,5-5,75 | 174-182 | max. 0,1 | max.100 |
| CHS-EPOXY® 575 | BPA/F resin modified by difunctional reactive diluent | Solventless coatings, penetrants, filled systems, casting applications and insulating materials, high solid coatings | 0,7-0,9 | 5,6-5,9 | 169-179 | max. 0,1 | max.100 |
| CHS-EPOXY® B 201 M 80 | 80% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketone | Prepregs for printed circuits boards, laminates, UV blocking | 1,5-2 | 2,3-2,5 | 400-435 | max. 0,1 | |
| CHS-EPOXY® 572 | BPA/F epoxy resin | Coatings, penetrants, filled systems, casting applications and insulating materials | 4,5-7,0 | 5,5-5,8 | 172-182 | max. 0,03 | max.100 |
| Produkt | Description | Application | Viscosity (Pa) | Epoxy index | EEW | Hydrolysable chlorine | Colour (Gardner) |
|---|---|---|---|---|---|---|---|
| CHS-EPOXY® B 201 M 80 | 80% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketone | Prepregs for printed circuits boards, laminates, UV blocking | 1,5-2 | 2,3-2,5 | 400-435 | max. 0,1 | max.1 |
| CHS-EPOXY® B 200 M 80 | 80% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketone | Prepregs for printed circuits boards, laminates | 1,1-2,3 | 1,8-2,3 | 435-556 | max. 0,1 | max.1 |
| Produkt | Description | Application | Viscosity (Pa) | Epoxy index | EEW | Hydrolysable chlorine | Colour (APHA) |
|---|---|---|---|---|---|---|---|
| CHS-EPOXY® 573 | BPA/F epoxy resin | Coatings, penetrants, filled systems, casting applications and insulating materials | 8,0-10,5 | 5,3-5,6 | 179-189 | max. 0,03 | max.100 |
| CHS-EPOXY® 574 | BPA/F resin modified by difunctional reactive diluent | Composites, civil and electrical engineering, high-solid coatings | 1,4-1,7 | 5,5-5,75 | 174-182 | max. 0,1 | max.100 |
| CHS-EPOXY® 575 | BPA/F resin modified by difunctional reactive diluent | Solventless coatings, penetrants, filled systems, casting applications and insulating materials, high solid coatings | 0,7-0,9 | 5,6-5,9 | 169-179 | max. 0,1 | max.100 |
| CHS-EPOXY® 572 | BPA/F epoxy resin | Coatings, penetrants, filled systems, casting applications and insulating materials | 4,5-7,0 | 5,5-5,8 | 172-182 | max. 0,03 | max.100 |
| CHS-EPOXY® 514 | BPA/F resin modified by monofunctional reactive diluent | Composites, high solid, anticorrosion paints, civil engineering, casting | 0,8-1,1 | 5,1-5,4 | 185-196 | max. 0,1 | max.100 |
| Produkt | Description | Application | Viscosity (Pa) | Epoxy index | EEW | Hydrolysable chlorine | Colour (Gardner) |
|---|---|---|---|---|---|---|---|
| CHS-EPOXY® 200 M 75 | Solution in methyl ethyl ketone | Production of prepregs | 0-2,0 | 1,9-2,3 | 435-525 | max. 0,015 | max.1 |
| CHS-EPOXY® 200 M 80 | Solution in methyl ethyl ketone | Production of prepregs | 2,5-5,5 | 2,0-2,4 | 410-500 | max. 0,015 | max.1 |
| CHS-EPOXY® 520 M 80 | 80% solution in methyl ethyl ketone | High solid coatings, prepregs etc. | 0,04-0,05 | 4,1-4,4 //3 | 227-244 //3 |
| Produkt | Description | Application | Viscosity (Pa) | Epoxy index | EEW | Colour (APHA) |
|---|---|---|---|---|---|---|
| CHS-EPOXY® 498 | Epoxy resin modified with mono-functional reactive diluent | Civil engineering, potting and impregnation | 0,5- 0,7 | 4,8-5,1 | 196-208 | max.100 |
| Produkt | Description | Application | Epoxy index | EEW |
|---|---|---|---|---|
| CHS-EPOXY® 301 | BPA type semisolid epoxy resin | Hot casting, solventborne coatings, prepregs | 2,7-3,3 | 300-370 |
| CHS-EPOXY® 530 | BPA type | Modifications, adhesives, composites | 5,38-5,68 | 176-186 |
| CHS-EPOXY® 411 | BPA type semisolid epoxy resin | Hot casting, solventborne coatings, prepregs | 3,9-4,2 | 238-256 |
| CHS-EPOXY® 590 | BPF type | Modifications, adhesives, composites | 5,70-6,06 | 165-175 |
| CHS-EPOXY® 520 | BPA type | Modifications, adhesives, composites | 5,21-5,50 | 182-192 |
| Produkt | Description | Application | Epoxy index | EEW |
|---|---|---|---|---|
| CHS-EPOXY® 301 | BPA type semisolid epoxy resin | Hot casting, solventborne coatings, prepregs | 2,7-3,3 | 300-370 |
| CHS-EPOXY® 411 | BPA type semisolid epoxy resin | Hot casting, solventborne coatings, prepregs | 3,9-4,2 | 238-256 |
| Produkt | Description | Application | Viscosity (Pa) | Epoxy index | EEW | Hydrolysable chlorine | Colour (APHA) |
|---|---|---|---|---|---|---|---|
| CHS-EPOXY® 530 | BPA type | Modifications, adhesives, composites | 8,0-10,0 | 5,38-5,68 | 176-186 | max. 0,03 | max.100 |
| CHS-EPOXY® 590 | BPF type | Modifications, adhesives, composites | 3,0-5,5 | 5,70-6,06 | 165-175 | max. 0,03 | max.100 |
| CHS-EPOXY® 510 | BPA type, low tendency to crystallize | Modifications, adhesives, composites | 12,5-16,0 | 5,18-5,46 | 183-193 | max. 0,03 | max.200 |
| CHS-EPOXY® 525 LA | BPA type with low α-glycol content | Modifications, adhesives, composites | 10,0-12,0 | 5,30-5,50 | 182-189 | max. 0,03 | max.100 |
| CHS-EPOXY® 520 | BPA type | Modifications, adhesives, composites | 12,0-14,5 | 5,21-5,50 | 182-192 | max. 0,03 | max.100 |
| Produkt | Description | Application | Viscosity (Pa) | Epoxy index | EEW | Hydrolysable chlorine | Colour (APHA) |
|---|---|---|---|---|---|---|---|
ENVIPOXY® 525 | BPA type | Modifications, adhesives, composites | 10,0-12,0 | 5,29-5,59 | 179-189 | max. 0,03 | max.100 |
| ENVIPOXY® 510 | BPA type, low tendency to crystallize | Modifications, adhesives, composites | 12,5-16,0 | 5,18-5,46 | 183-193 | max. 0,03 | max.200 |
| ENVIPOXY® 530 | BPA type | Modifications, adhesives, composites | 8,0-10,0 | 5,38-5,68 | 176-186 | max. 0,03 | max.100 |
| ENVIPOXY® 520 | BPA type | Modifications, adhesives, composites | 12,0-14,5 | 5,21-5,50 | 182-192 | max. 0,03 | max.100 |
| Produkt | Description | Components | Mixing ratio | Tg, DSC | Pot-life | Shear strength |
|---|---|---|---|---|---|---|
| VEROBOND® 520-2608 | Structural adhesive with high elongation up to 55% with excellent peel and shear strength. | A/B | 100/140 | 70-80 | 20 min/25°C/50g | 20-25 |
| VEROBOND® SUPER | Structural adhesive with high elongation up to 55% with excellent peel and shear strength. | A/B | 100/100 | 70-80 | 20 min/25°C/10g | 20-24 |
| VEROBOND® QUICK | Unique, very fast epoxy adhesive (5 minutes curing time). | A/B | 100/100 | 50-60 | 3 min/25°C/10g | 10-Dec |
| VEROBOND® 14 | Epoxy adhesive cured at room temperature. Systems is a thixotropic paste of high strength with good chemical resistance. | A/B | 100/50 | 80-85 | 60 min/25°C/100g | 20-24 |
| VEROBOND® 521-0846 | Two-component epoxy structural adhesive. It is used for structural bonding of a wide range of substrates, especially metals, metal structures, wood and ceramics. | A/B | 100/50 | 60-70 | 28 min/25°C/15g | 6-Aug |
| Produkt | Description | Components | Mixing ratio | Tg, DSC | Pot-life | Shear strength |
|---|---|---|---|---|---|---|
| VEROBOND® 520-2608 | Structural adhesive with high elongation up to 55% with excellent peel and shear strength. | A/B | 100/140 | 70-80 | 20 min/25°C/50g | 20-25 |
| VEROBOND® SUPER | Structural adhesive with high elongation up to 55% with excellent peel and shear strength. | A/B | 100/100 | 70-80 | 20 min/25°C/10g | 20-24 |
| VEROBOND® QUICK | Unique, very fast epoxy adhesive (5 minutes curing time). | A/B | 100/100 | 50-60 | 3 min/25°C/10g | 10-Dec |
| VEROBOND® 14 | Epoxy adhesive cured at room temperature. Systems is a thixotropic paste of high strength with good chemical resistance. | A/B | 100/50 | 80-85 | 60 min/25°C/100g | 20-24 |
| VEROBOND® 521-0846 | Two-component epoxy structural adhesive. It is used for structural bonding of a wide range of substrates, especially metals, metal structures, wood and ceramics. | A/B | 100/50 | 60-70 | 28 min/25°C/15g | 6-Aug |
| Produkt | Description | Components | Mixing ratio | Tg, DSC | Pot-life | Viscosity (mPa.s) |
|---|---|---|---|---|---|---|
| CHS-EPODUR® 520-1997 | High thermal resistance. Post curing above 160°C. | A/B/C3 | 100/95/1 | 165-175 | > 10 h/25°C | 1 000-1 200 //5 |
| CHS-EPODUR® 520-1687 | Long pot life, low viscosity. Curing at higher temperature (at least 80°C). | A/B/C2 | 100/90/1 | 130-145 | > 10 h/25°C | 500-1 000 //5 |
| CHS-EPODUR® 574-0904 | Laminated system with medium viscosity. High adhesion to dural, steel and other metal surfaces. | A/B | 100/50 | 70-80 | 12-15 min/25°C | 1 600-2 200 //5 |
| CHS-EPODUR® 520-1667 | Low viscosity. Curing at higher temperature (at least 80°C). | A/B/C2 | 100/85/1 | 115-130 | > 10 h/25°C | 500-1 000 //5 |
| CHS-EPODUR® 520-1787 | High mechanical properties, long pot life. Curing at higher temperature (at least 80°C). | A/B/C1/D1 | 100/85/0.5/10 | 85-95 | > 10 h/25°C | 1 500-2 000 //5 |
| Produkt | Description | Components | Mixing ratio | Tg, DSC | Pot-life |
|---|---|---|---|---|---|
| CHS-EPODUR® 525-0269 | Solvent-free epoxy prepregging system with chemically induced B-stage, adjustable tack/ drapability. For cold, simple equipped processing. Recommended for general industrial and sport & leisure applications. | A/B/C55 | 100/12/0-3 | 115 - 135 | 2 - 8 h //12 |
| CHS-EPODUR® 411-0269 | Solvent-free epoxy system for hot-melt prepregging, adjustable tack. For industrial and sport & leisure composite applications. | A/B/C55 | 100/9/0-2 | 120 - 128 | 0,5 - 2 h //12 |
| CHS-EPODUR® N 554-0249 | Solvent-free epoxy system for hot-melt prepregging, adjustable tack/drapability. For applications with higher temperature resistance. | A/B/C55 | 100/10/0-3 | 120 - 165 | 1 - 4 h //12 |
| Produkt | Description | Components | Mixing ratio | Tg, DSC | Pot-life | Viscosity (mPa.s) |
|---|---|---|---|---|---|---|
| CHS-EPODUR® 520-1687 | Long pot life, medium viscosity. Curing at higher temperature (at least 80°C). | A/B/C2 | 100/90 /1 | 130-145 | > 10 h/25°C | 500-1 000 //5 |
| CHS-EPODUR® 520-1667 | Medium viscosity. Curing at higher temperature (at least 80°C). | A/B/C2 | 100/85/1 | 115-130 | > 10 h/25°C | 500-1 000 //5 |
| CHS-EPODUR® 520-1997 | High thermal resistance. Post curing above 160°C. | A/B/C3 | 100/95/1 | 165-175 | > 10 h/25°C | 1 000-1 200 //5 |
| CHS-EPODUR® 520-1787 | High mechanical properties, long pot life. Curing at higher temperature (at least 80°C). | A/B/C1/D1 | 100/85/0,5/10 | 85-95 | > 10 h/25°C | 1 500-2 000 //5 |
| CHS-EPODUR® 574-0522 | Curing at ambient temperature, slow reactivity. | A/B | 100/30 | 85-100 | 1-2 h/25°C | 200-500 //5 |
| Produkt | Description | Application | Viscosity (Pa) | Epoxy index | EEW | Hydrolysable chlorine | Colour (Gardner) |
|---|---|---|---|---|---|---|---|
| CHS-EPOXY® B 201 M 80 | 80% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketone | Prepregs for printed circuits boards, laminates, UV blocking | 1,5-2 | 2,3-2,5 | 400-435 | max. 0,1 | max.1 |
| CHS-EPOXY® B 200 M 80 | 80% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketone | Prepregs for printed circuits boards, laminates | 1,1-2,3 | 1,8-2,3 | 435-556 | max. 0,1 | max.1 |
| Produkt | Description | Application | Viscosity (Pa) | Epoxy index | EEW | Hydrolysable chlorine | Colour (Gardner) |
|---|---|---|---|---|---|---|---|
| CHS-EPOXY® B 201 M 80 | 80% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketone | Prepregs for printed circuits boards, laminates, UV blocking | 1,5-2 | 2,3-2,5 | 400-435 | max. 0,1 | max.1 |
| CHS-EPOXY® B 200 M 80 | 80% solution of brominated (21% wt.) medium molecular weight epoxy resin, dissolved in methyl ethyl ketone | Prepregs for printed circuits boards, laminates | 1,1-2,3 | 1,8-2,3 | 435-556 | max. 0,1 | max.1 |
| Produkt | Description | Application | Viscosity (mPa) | Epoxy index | Hydrolysable chlorine | Colour (Gardner) |
|---|---|---|---|---|---|---|
| CHS-EPOXY® RR 800 | 1, 4-butanediol diglycidyl ether | Excellent reactivity at low temperatures and good solvent resistance, high mechanical strength, limited acid resistance | Oct-25 | 7,60-8,10 | max. 0,2 | max.1* |
| CHS-EPOXY® RR 690 | Trimethylol propane triglycidyl ether | Excellent mechanical strength and reactivity, hot water and solvent resistance, limited diluting power | 130-200 | 7,20-7,70 | max. 0,1 | max.1* |
| CHS-EPOXY® RR 330 | C12-C14 alkyl glycidyl ether | Low toxicity and vapour pressure, good diluting power, reduced reactivity | 5-Oct | 2,94-3,70 | max. 0,1 | max.1* |
| CHS-EPOXY® RR 700 | 1, 6-hexanediol diglycidyl ether | Excellent reactivity at low temperatures and good solvent resistance, high mechanical strength, limited acid resistance | 15-25 | 6,70-7,20 | max. 0,2 | max.1* |
| CHS-EPOXY® RR 300 | Polypropyleneglycol diglycidyl ether | Flexibilizer, low toxicity and vapour pressure, reduced reactivity, limited diluting power | 40-90 | 2,90-3,30 | max. 0,3 | max.2* |
| Produkt | Description | Application | Viscosity (mPa) | Amino number | HEW |
|---|---|---|---|---|---|
| TELALIT® 0600 | Cycloaliphatic, modified | High performance composites, long pot life, highest Tg | 80-100 | 450-500 | 62 |
| TELALIT® 0842 | Solvent free system, under water curing | Hardening in wet conditions, applicable in different weather conditions. | 1 100-1 900 | min.290 | 84 |
| TELALIT® 0590 | Polyoxyetheramine | Composites, long pot life | 5-Oct | 440-490 | 59 |
| TELALIT® 0903 | Cycloaliphatic adduct modified | Self-levelling flooring, nonylphenol free, low yellowing | 200-500 | 320-350 | 90 |
| TELALIT® 1040 | Polyoxyetheramine | Waterborne coatings, high solid coatings, nonylphenol free. | Oct-30 | 230-260 | 104 |
| Produkt | Description | Application | Viscosity (mPa) | Epoxy index | Hydrolysable chlorine | Colour (Gardner) |
|---|---|---|---|---|---|---|
| CHS-EPOXY® RR 800 | 1, 4-butanediol diglycidyl ether | Excellent reactivity at low temperatures and good solvent resistance, high mechanical strength, limited acid resistance | Oct-25 | 7,60-8,10 | max. 0,2 | max.1* |
| CHS-EPOXY® RR 690 | Trimethylol propane triglycidyl ether | Excellent mechanical strength and reactivity, hot water and solvent resistance, limited diluting power | 130-200 | 7,20-7,70 | max. 0,1 | max.1* |
| CHS-EPOXY® RR 330 | C12-C14 alkyl glycidyl ether | Low toxicity and vapour pressure, good diluting power, reduced reactivity | 5-Oct | 2,94-3,70 | max. 0,1 | max.1* |
| CHS-EPOXY® RR 700 | 1, 6-hexanediol diglycidyl ether | Excellent reactivity at low temperatures and good solvent resistance, high mechanical strength, limited acid resistance | 15-25 | 6,70-7,20 | max. 0,2 | max.1* |
| CHS-EPOXY® RR 300 | Polypropyleneglycol diglycidyl ether | Flexibilizer, low toxicity and vapour pressure, reduced reactivity, limited diluting power | 40-90 | 2,90-3,30 | max. 0,3 | max.2* |
You can also find a comprehensive range of products in the product catalogue (PDF).
If you require detailed product information, please do not hesitate to contact us contact.
