| Description | Epoxy adhesive cured at room temperature. Systems is a thixotropic paste of high strength with good chemical resistance. |
|---|---|
| Usage | |
| Components | A/B |
| Mixing ratio (pbw) | 100/50 |
| Tg, DSC (°C) | 80-85 |
| Pot-life | 60 min/25°C/100g |
| Shear strength (MPa) | 20-24 |
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